electric_bolt Power Electronics Calculator

Buck Converter Power Stage Calculator

Full loss-budget analysis with 10-mechanism efficiency modeling, synchronous & catch-diode topologies, multi-phase ripple cancellation, transient droop budgeting, and Middlebrook input-filter stability verification.

tune

Design Parameters

bolt Core Parameters
expand_more
500 kHz
30%
Typical: 10–100 mV (0.1–1% of Vout)
swap_horiz Topology & Phases
expand_more
Rectification Topology
Schottky: 300–500 mV
memory MOSFET Parameters
expand_more
timer Dead Time & Snubber
expand_more
Set to 0 to disable snubber loss
air Inductor Parameters
expand_more
battery_charging_full Output Capacitor Bank
expand_more
sensors Current Sense
expand_more
Sensing Method
filter_alt Input Filter & Stability
expand_more
trending_up Transient Response
expand_more
0 = instantaneous step (worst case)
Duty Cycle
%
Min Inductance
µH
Min Output Cap
µF
Peak Inductor Current
A
RMS Inductor Current
A
RMS Input Current
A
Efficiency
%
Total Power Loss
W
Output Ripple (actual)
mV
Inductor Slew Rate
A/µs
Transient Recovery
µs
Middlebrook Margin
dB
show_chart

Efficiency vs. Load Current

η (%) swept from 0.01% to 100% of rated Iout. ● marks the rated operating point.

bar_chart

Loss Breakdown at Rated Load

Proportional contribution of each loss mechanism (mW).

functions Key Design Equations

D= Vout / Vin L_min= (Vin − Vout) × D / (fsw × ΔiL) C_ripple= ΔiL / (8·fsw·√(ΔVout² − ΔV_esr²)) [ESR-aware] C_droop= L·ΔI²·K_slew / (2·Vout·(ΔV_droop − ΔI·ESR)) [ESR-aware] I_peak= I_phase + ΔiL/2 K(N,D)= Dm·(1/N−Dm) / (D·(1−D)) [ripple cancel] η= Pout / (Pout + Σ losses) × 100% |Zin|= Vin² / Pout [Middlebrook neg. impedance]

Ready to design your full power tree?

Use Electronics Architect to model your complete multi-rail system with buck converters, LDOs, loads, and real-time simulation.

schema Open Electronics Architect
Note: These tools and articles provide theoretical estimates for educational purposes. Actual results may vary depending on real-world component tolerances, parasitics, and thermal conditions.